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Reflow soldering oven with infrared and convection radiation.
REFLOW lead-free solder paste soldering oven. It consists of a reflow soldering oven with infrared and convection radiation. Forced hot air convection ensures a uniform temperature profile throughout the chamber. Once the door is opened, the cooling fans come on and quickly cool the printed circuit board (PCB) and components.
Use:
Connect the oven to the mains and the solder fume extraction tube to a filtering system. After the first power on, the oven is looking for an Android tablet or smartphone to pair with.
When both are connected in the Android app, choose the oven schedule. There are programmable temperatures and times for preheating, as well as temperatures and times for the soldering point (reflow) and other data.
When the oven is already programmed, the user can control the process with the buttons and the front panel display. There is an acoustic signal when the welding process ends. The same signal appears on the tablet or smartphone.
The Android application shows the process status, time and temperature or other information. An application for IOS systems is being planned but is not yet available.
Features
Lead-free solder paste reflow oven.
Ready for industry standard 4.0
Data transmission via bluetooth
Application Android to connect to a tablet or smartphone
100 different user programs
Connection for welding fume extraction
Manual opening and closing of the door.
Forced cooling of PCB after the soldering process
Electrical network: 230V, 50 Hz
Power consumption: 3100 W maximum on time
Dimensions (L x W x H): 460 x 370 x 330 mm
Weight: 16 Kg
Rack dimensions: 350 x 220 mm
Max. PCB Dimensions: 300 x 200 mm
Max. Height of components: 55 mm
Max. Temperature setting: 260°C
