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Photosensitized printed circuit board for double-sided printed circuit board production
Material: fiberglass
Size: 210 x 300 mm
Thickness fiber: 1,5 .. 1,6 mm
Copper thickness: 35 µm
Photosensitive emulsion thickness: 4 µm
CN3ARPP
Bungard 1823 - Positive Printed Circuit Board Developer - 72110
CN3AATR
Rapid Etchant
Available
