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Datasheet
Material
Polyamide Nylon enclosure suitable for encapsulating electronic assemblies. Resistant to deformation and extreme temperatures.
Dimensions: 53 x 8 x 21 mm
Material: PA6
Color: RAL 9004
HRE1PX0
Royal Diamond ROYAPOX 5050 CD - Epoxy Resin to Encapsulate or Fill Electronic Components