The heart of a semiconductor device is the silicon Chip. While many suppliers just buy the chips and assemble them into a package, Diotec has got the complete know how of semiconductor production. From wafer and chip production through assembly to testing and packaging: The necessary equipment is mostly produced by Diotec itself, optimized for each production step.
In the diffusion furnaces the raw material - the so called wafers - get their later diode behavior = pn-junction + special semiconductor characteristics. Then the wafers are sawed into single dice, the edges are cleaned and “passivated”, i. e. protected. Here the proprietary, environment-friendly Plasma-EPOS process is used, featuring double passivation for high reliability. The separation of the dice is done by Laser cutting.
Especially Zener and TVS diodes, with their large variety of partnames, are a major challenge with respect to base material, logistics and diffusion technology.
Diotec is one of the market leaders in this field, offering one of the widest range of products and fastest delivery time.